Case Sealing Applications
When it comes to case sealing, you need a reliable hot melt application system because protecting your product is crucial. ITW Dynatec hot melt equipment provides peace of mind along with cost savings, flexibility and superior performance.
Cases are closed at the end of the line by gluing the open flaps to seal the case. Applications vary based on the content and size of the package from bead applications working at medium range speeds to precise, high-speed glue dot applications.
Fig. 1 – Minor Flap Gluing Example (Brewery Case)
The components for a typical case sealing application are:
- ASU (Piston Pump)
- 2 Hoses
- 2 Bead Applicators
- Pattern Controller (if the pattern is not controlled by the OEM system)
Typical Glue Application
- Applying adhesive to the Major Flaps
- Applying adhesive to the Minor Flaps
Typical Glue Application (Multi-Orifice)
- Applying adhesive to the Major Flaps with multi orifice nozzles
- Applying adhesive to the Minor Flaps with multi orifice nozzles
Achieve Up Tp 50% Adhesive Savings!
It’s common to program “stitch” applications through the pattern controller settings. This offers glue savings without sacrificing bond strength.
OEMS – Case Sealing & Erecting Equipment
- Wexxar
- Wayne Automation
- Thiele/SWF
- Pearson
- Klippenstein
- ABC Packaging
- Design Machine