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Architectural Walls and Structural Insulated Panels

Dynatec’s Patented UFD, Uniform Fiber Deposition technology, allows for tightly controlled adhesive distribution across your substrate.  Our equipment is ideal for situations where the substrate is profiled, uneven, or otherwise indicates a need for non-contact gluing.  Adhesive is evenly distributed via the Fiberbond™ UFD Nozzles as the substrate passes underneath.  This allows the manufacturer to experience a wide range of substrate wave, profiled products, or differentiation between parts of the substrate as it passes underneath the applicators.
SIPS (Structural Insulated Panels) and architectural walls are prime candidates for our Fiberbond™ technology as manufacturers move to reduce labor costs, save manufacturing space, and streamline their processes.  As SIPS become more popular in the housing industries, increased ability to produce the correct number of customer specified panels for jobs in a timely fashion differentiates companies and allows them to have an edge.  Our system gives SIPS manufacturers that edge.

UFD Fiberbond Information Sheet
UFD Application Video Clip

To learn more about our complete line of industrial adhesive applicators please take a moment to view our product line or contact one of our industrial adhesive applicator specialists.