ITW Dynatec Pinch Bottom Applicator

Experienced in
meeting the needs of
hot melt applications
for 40 years.

ITW Dynatec Pinch Bottom Applicator

Independently heated die and service block
Quick change slip-on-die lip
Self centering die lip
Titanium coated steel die adapter reduces wear and adhesive build-up
Selectable hose inlets
Symmetrical design mounting heads for change over versatility
Head mounted adhesive pressure gauge

ITW Dynatec's MR1300 High Flow Slot Die adhesive Applicator Head is and air-operated, singgle-module, hot melt adhesive applicator assembly commonly used in the pinch-bottom bag industry. A choice of bracketry allows setup for right or left hand or up or down apply applications, depending on requirements.

The applicator is heated by replaceable cartridge heating elements which are controlled by an intergrated RTD sensor and electronic control. High Flow applicators are available configured for ITW Dynatec's DyanControl, MTC/CompuVision or Allen-Bradley PLC controls.

ITW Dynatec Pinch Bottom Applicator Equipment Product Literature Downloads:

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ITW Dynatec High Flow Slot Die Service and Operating Manual