Experienced in
meeting the needs of
hot melt applications
for 40 years.

ITW Dynatec Dynacold High Speed Glue Applicator

ITW Dynatec Dynacold High Speed Glue Applicator

Key Features Include:

  • Two millisecond cycle time
  • Robust ball and seat design along with the elimination of dynamic seals result in minimized wear and extended life
  • Stainless steel construction and proven modular components
  • Adhesive application pressures to 600 psi (40 bar) with fluid viscosities to 6000 centipoise

ITW Dynatec Dynacold High Speed Glue Applicator Product Literature Downloads:

ITW Dynatec Dynacold High Speed Glue Applicator

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Service Manual

Typical DynaCold Configurations



  • Cycle Time Approximately 2ms
  • Fluid Pressure to 450psi
  • Fluid Viscosity to 6,000 cps
  • Multiple Configurations:
    • Contact/Non-Contact
    • Single/Multi Orifice
    • Nozzle Plate
    • Right Angle Applications